Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection)
| タイトル | Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) |
| 発売日 | 販売日未定 |
| 製作者 | John H. Lau |
| 販売元 | McGraw-Hill Professional |
| JANｺｰﾄﾞ | 9780071363273 |
| カテゴリ | McGraw-Hill » McGraw-Hill Engineering Store » Civil Engineering » Building Materials |