Chip Scale Package: Design, Materials, Process, Reliability, and Applications (Mcgraw-Hill Electronic Packaging and Interconnection Series) の感想
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| タイトル | Chip Scale Package: Design, Materials, Process, Reliability, and Applications (Mcgraw-Hill Electronic Packaging and Interconnection Series) |
| 発売日 | 販売日未定 |
| 製作者 | John H. Lau |
| 販売元 | McGraw-Hill Professional |
| JANｺｰﾄﾞ | 9780070383043 |
| カテゴリ | McGraw-Hill » McGraw-Hill Engineering Store » Electrical Engineering » Circuits |
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Chip Scale Package: Design, Materials, Process, Reliability, and Applications (Mcgraw-Hill Electronic Packaging and Interconnection Series)
