Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (Electronic Packaging and Interconnection Series) の感想
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| タイトル | Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (Electronic Packaging and Interconnection Series) |
| 発売日 | 販売日未定 |
| 製作者 | John H. Lau |
| 販売元 | McGraw-Hill Professional |
| JANｺｰﾄﾞ | 9780070366480 |
| カテゴリ | McGraw-Hill » McGraw-Hill Engineering Store » Electrical Engineering » Circuits |
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (Electronic Packaging and Interconnection Series)
